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17.04.2014
Commissioned a new production for the assembly of heat metering devices.
EAS
PCB Design Print this page
 

"RD Electronic" perfoms computerized design of printed circuit boards in following system formats: "PCAD", "Cambridge System", "Eagle" and "CAM 350" according customer's requirements.

Producing of printed circuit boards is based on Customer's documentation generated by standart CAD programs. Files with complete documentation should be devided in some parts:

  • PCB's Topography (wires routing, pad locations,outline and e.t.c.)
  • Aperture Table (name of aperture,shape and size)
  • Drill data (in Excellon or Shieb&Meyer formats)

Size of all apertures should be given in one type of unit.


1. Material
1.1 Standard laminat thickness 0.5 mm, 0.8 mm, 1.0 mm
1.55 mm, 2.0 mm, 2.4 mm
1.2 Other laminats at customers request
1.3 Copper foil thickness - standart 17.5 um, 35 um
1.4 Other foil thickness at customer request 50, 70, 105 um

2.Mechanical features.
2.1 Drilling.
2.1.1 Accuracy of drilling mashine positioning +-0.025 mm
2.1.2 Minimal hole diameter 0.5 mm
2.1.3 Holes with diameter bigger than 4 mm are routed
2.1.4 Non-plated holes tolerance
diameter
0.3 - 3.0 mm
3.1 - 4.0 mm
4.0 - 6.3 mm
>6.3 mm


tolerance
+-0.05 mm
+-0.10 mm
+-0.15 mm
+-0.15 mm
2.1.5 Plated holes tolerance - all diameters +0.10 mm -0.05 mm
2.1.6 Thickness of metallization 25+-5 um

2.2 Routing
2.2.1 Max panel size 280x280 mm
2.2.2 Standart diameter of routing tool 2 mm
2.2.3 At customer request 1 mm
2.2.4 Routing tolerance +-0.10 mm
2.2.5 Routed gaps width
non plated
plated


>=1.0 mm
0.9 mm

2.3 Cutting
2.3.1 Min panel size 170x210 mm
2.3.2 Max pcb size 400x500 mm
2.3.3 Max size (leight) pcb with galvanic goldening 300 mm
2.3.4 Cutting tolerance (min pcb size 15x15 mm) +-0.15 mm

3.PCB topology
3.1 Min pads diameter Hole diam.+ 0.4mm
3.1.1 Min wire width or wire/wire or pads separation
Copper foil thicknessWire widthSeparation
17.5 um150 um150 um
35 um200 um200 um
70 um300 um>300 um
3.2 Min wire/ pcb edge separation
3.2.1 with routing
3.2.2 with cutting


0.2 mm
0.3 mm

4.Solder resist
4.1 liquid solder resist - core thickness
in a middle of pcb
on pcb edge
Pad diameter with 35 um copper
Pad diameter with 18 um copper

>20 um
>10 um
+0.4 mm
+0.25 mm

5. Silkscreen(screen printing technology)

Photoplotter
Drilling machine
Photoprinter
Etching
Scoring